Additional Solder Materials

AIM offers a variety of Epoxies, Underfills, Chemicals and Cleaners that are fully compatible with our many solder pastes, epoxies, fluxes and cored wires. Formulated for application by hand or automated dispensing equipment, these products are available in industry standard packaging. 

 Epoxy 4044 is single part epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4044 is formulated to resist shear-thinning and has rapid thermal cure properties. The viscosity and surface tension of Epoxy 4044...
 One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-...
 Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, auger valve, piston and...
 Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underfill FF35 offers superior reliability...
 Common Flux Thinner is a solvent that is used to thin Water Soluble, No Clean and RMA fluxes in foaming and some spray applications.