By Tim O’Neill, Technical Marketing Manager
Published in CIRCUITS ASSEMBLY
Would you believe QFN ground pad voids could be cut by over 50% with a zero-cost, super-simple stencil aperture modification? Not a mod to the ground pad apertures where the voiding is problematic, just to the I/O apertures? Neither did we. That’s why we did some deeper digging into what we are now calling the “AIM I/O” aperture modification.
In November’s column, we reported a dramatic reduction in voids when QFN I/O pads were left unpasted, and mentioned our technical staff’s observations and ensuing experiments led us to this new void mitigation technique, but we didn’t explicitly describe the I/O aperture design. It’s a simple...