Solder Materials for the LED Industry

AIM Your Partner in LED Electronics

 

AIM Solder is committed to the development of solder paste and alloys for current and emerging technologies within the LED industry. Partnering with global leaders in LED assembly and manufacturing drives development to provide the materials best suited to meet the industry’s requirements. As LED assemblies continue to shrink, AIM is positioned to provide solutions to miniLED and microLED applications with world-class technical support and innovative product offerings.  AIM’s high-reliability REL alloys and void-free solder pastes were developed in these partnerships to improve upon existing technologies.

 

AIM Solder Understands LED Industry Challenges

How AIM Products Resolve LED Challenges:

• Advancement in solder alloy technology and flux formulation meet reliability standards for longer LED lifespan

• Low voiding materials can withstand thermal environmental stresses

• High-speed print capabilities maximize throughput and reduce costs

• Clear, minimal no clean residues

 

Benefits of Partnering with AIM:

• Proven materials for advanced reliability, emerging technology and increased functionality

• Consistency of product quality, product performance, and product delivery on an international scale

• Access to training and support in local language and local time across the globe

• Ability to investigate customer challenges using AIM’s state-of-the-art Applications Lab

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Recommended AIM LED Solder Products

Below please find a list of AIM's recommended products designed primarily for LED applications.

 

AIM REL22TM Solder Alloy

- Unparalleled Thermal Cycling Performance to Handle Rapid LED Temperature Changes 

- Reduces Void Formation Associated with LED Overheating

- Outperforms First Generation SAC+Ni+Sb+Bi  High Reliability Alloys

- Lower Processing Temperatures Compared to SAC

- Available in Bar, Wire & Paste

 

AIM REL61TM Solder Alloy

- Enhanced Durability for Use in Harsh Thermal Environments 

- Reduces Void Formation Associated with LED Overheating

- Low Silver Cost Reduction Alloy

- Lower Processing Temperatures Compared to SAC

- Available in Bar, Wire & Paste

 

AIM SN100C Solder Alloy

- Similar Performance to SAC  

- Low Silver Cost Reduction Alloy

- Reduces Void Formation Associated with LED Overheating

- High Reliability During Vibration and Mechanical Shock

- Available in Bar, Wire & Paste

 

AIM M8 Solder Paste

- Excellent Print Transfer Efficiencies for Small Components and Low Area Ratios  

- Reduces Void Formation Associated with LED Overheating

- Minimal, Transparent Residue – LED Compliant

- Stable High Speed Print Performance up to 152mm/s to Increase Process Yields

 

AIM NC259 Solder Paste

- Precise Print Definition and High Print Transfer Efficiencies 

- Reduces Void Formation Associated with LED Overheating

- Minimal, Transparent Residue – LED Compliant

- Excellent Wetting Characteristics