Recent News

AIM’s Timothy O’Neill to Participate in the Panel Discussion on High Thermal Demand Soldering Applications Webinar

Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Tim O’Neil, Director of Product... read more

AIM’s Dr. Sirine Bayram to Present at International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dr. Sirine Bayram, Research Scientist,... read more

AIM’s Flopy Feng to Present at Hangjiatalk MiniLED Backlight Application Analysis Forum

Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2021... read more

Recent Technical Articles

Effect of Under-stencil Wipe Chemistry on Print Performance

Can a change of solvent in the printer improve SMT printing? ANY ENGINEER WILL TESTIFY lab testing may not correlate with field results. Laboratory data are developed under ideal conditions to... read more

Is SMT Ready for Low-Temperature Solders?

With no standard in sight, emerging alloys require unique fluxes and processes. LOW-TEMPERATURE SOLDERING is a subject of considerable interest and development. Several forces are driving... read more

Profiles in Expertise

Is reflow the only process where the outcome could be impacted in real-time? One of AIM’s field engineers came back from a cross-country trip this week with stories of a profiling issue that was... read more