AIM’s REL22™ Awarded Circuits Assembly’s NPI Award 2018

Cranston, Rhode Island USA - AIM, a leading global manufacturer of solder assembly materials for the electronics industry, announces that their REL22™ high reliability solder alloy was awarded Circuits Assembly’s New Product Introduction (NPI) Award 2018 at IPC Apex at the San Diego Convention Center. 

Selected by an independent panel of industry experts, the Circuits Assembly NPI award winner is selected based on creativity & innovation, compatibility with existing technology, cost effectiveness, expected reliability, performance, and more.

AIM’s REL22 lead-free solder alloy is specifically engineered as an exceptionally durable alloy for extreme service environments and provides superior thermal cycling performance and lower voids versus other lead-free alloys. It has been shown to reduce tin whisker formation and improved strength versus SAC alloys making them ideal for high reliability electronics applications.

“AIM’s R&D, production and technical staff share in the success of REL22 and we are honored to have their efforts recognized in Circuits Assembly’s NPI 2018 award,” said Tim O’Neill, AIM Technical Marketing Manager.  “REL22 provides assemblers with a novel material to meet the needs of an evolving market and is a direct result of AIM’s focus and commitment to technological innovation.  REL22 is simply the most advanced and capable alloy available in the high reliability solder market space and this award confirms it.”


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