AIM’s Flopy Feng to Present at the SMTA China South Technology Conference

Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the SMTA China South Technology Conference on August 27-30, 2018. Flopy Feng, Technical Support Engineer, will present on August 29, 2018 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Flopy’s presentation, scheduled for Wednesday, August 29, 2018, will highlight the effectiveness of I/O stencil aperture modifications on BTC void reduction. Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Flopy’s presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China.  

To discover all of AIM’s products and services, visit the company at the SMTA China South Expo & Tech Forum or on their website at


Upcoming Events:

September 6, 2018 - SMTA Monterrey – Crowne Plaza Aeropuerto, Monterrey, Mexico

September 12, 2018 - SMTA New England – DCU Center, Worchester, MA, USA

October 4, 2018 – SMTA Long Island – Melville Marriott, Melville, NY, USA

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