AIM’s Flopy Feng to Present at SMTA China South Conference

Cranston, Rhode Island USA ― AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng, Technical Support Engineer, will present at the SMTA China South Technology Conference on August 26th, 2021 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Based on AIM’s recent study, Flopy’s presentation, will highlight the effects of reducing alloy powder size on solder paste print performance.  The goal of the study measures the benefits derived from smaller particle size and quantifies the negative implications. 

About Presenter
Flopy Feng is an Award-Winning Presenter and Technical Support Manager for AIM Solder, with over 20 years’ of experience in the SMT industry. Having worked as a process supervisor for many years, he is experienced in process evaluation and optimization.  Flopy supports AIM customers in the South China region.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit