AIM to Highlight V9, Ultra Low-Voiding, No Clean Solder Paste at IPC Apex 2022

Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their upcoming attendance at IPC APEX EXPO taking place January 25-27, 2022, at the San Diego Convention Center in San Diego, California.  AIM will highlight V9, their new ultra low-voiding, no clean paste, along with their full line of solder assembly materials.

Formulated to solve one of the industry’s most difficult challenges, V9 studies have proven to reduce voiding to as low as 1% on BGAs and <5% on BTCs components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possess high SIR values required for high reliability applications. Both REACH and RoHS compliant, AIM’s V9 Low-Voiding No Clean Solder Paste is available in SAC305 T4.

AIM will also highlight its REL22™ and REL61™ alloys and NC273LT low temperature solder paste.  When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement. AIM’s REL22™ improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61™ is ideally suited for industries which require a cost-effective alternative to SAC305 with no loss of processing performance or durability. 

For more information about the groundbreaking V9 low-voiding, no clean paste and AIM’s complete line of solder products and services, including lead-free and halogen-free products, visit the company at booth #519 at IPC APEX 2022 or visit


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