AIM to Highlight REL61™ at SMT Hybrid Packaging on June 5 - 7, 2018

Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at SMT Hybrid Packaging, scheduled to take place on June 5 - 7, 2018 at the NürnbergMesse Exhibition Center in Nuremberg, Germany. AIM Solder will highlight its novel REL electronic solders, REL22™ and REL61™.

These new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings.  REL22 is an award winning, high reliability alloy with durability characteristics double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys.  With a 10°C lower melting temperature and superior wetting performance, REL61 can lower process temperatures, prevent PCB damage and reduce costs and waste. 

AIM REL alloys are available in paste, wire and bar formats. Additionally, AIM will highlight its full line of advanced solder materials, including its solder paste, liquid flux and solder alloys. For more information on these products, visit AIM at stand #4-424 and online


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Upcoming Events:

May 15, 2018 – SMTA Carolinas – DoubleTree Raleigh Brownstone, Raleigh, NC

May 17, 2018 – TEC Warsaw -  DoubleTree by Hilton Hotel & Conference Centre, Warsaw, Poland

May 22, 2018 – SMTA Michigan – Laurel Manor, Livonia, MI