AIM will highlight their full range of specialty joining materials at the IMAPS 49th International Symposium on Microelectronics, scheduled to take place October 11-13th, 2016 at the Pasadena Convention Center in Pasadena, California.
AIM Solder is pleased to announce that Karl Seelig, V.P. of Technology, will present at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 5th – 6th, 2016 at the RIU Hotel Guadalajara in Guadalajara, Mexico.
AIM Solder announces the release of its new corporate video, Behind the Name | AIM Solder. The video is available on the AIM Solder website, as well as in all AIM Solder’s social media sites.
AIM Solder is pleased to announce their participation at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 5th – 6th, 2016 at RIU Hotel Guadalajara in Guadalajara, Mexico.
AIM Solder is pleased to announce their participation at the SMTA International trade show, scheduled to take place September 27th-28th, 2016 at the Donald Stephens Convention Center in Rosemont, Illinois.
AIM Solder continues to aggressively invest in its R&D program, to stay ahead of the technology curve and solidify its presence at the forefront of innovative product development in the electronics assembly industry.
AIM Solder announces new white paper to be released in the coming months, titled “Evaluating the Impact of Stencil Nano-Coating and Stencil Foil Mounting Tension on Overall Print Quality of Miniaturized Devices.”
AIM Solder is pleased to announce their participation at the SMTA Capital Expo & Tech Forum, scheduled to take place August 30th, 2016 at the Johns Hopkins University in Laurel, Maryland.
AIM Solder is pleased to announce their participation at the SMTA Ohio Expo & Tech Forum, scheduled to take place August 4th, 2016 at the Embassy Suites Hotel in Independence, Ohio.