Press Room

AIM’s Mehran Maalekian to Present at ICSR Toronto 2017

AIM's Mehran Maalekian will present his white paper “Low Silver SAC-Bi Lead-Free Solder For Enhanced Reliability” at the International Conference on Soldering and Reliability (ICSR) in Ontario, Canada.

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AIM王勇荣获最佳演绎奖 SMTA中国华东高科技设备研讨会

克兰斯顿 罗德岛州 美国—作为全球电子工业焊料组装材料的领先生产商,AIM焊材宣布,王勇,AIM技术支持经理,出席SMTA中国华东高科技设备研讨会发表演讲,并荣获最佳演绎奖。

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AIM Introduces New J8 No Clean Jetting Solder Paste

AIM is pleased to announce the introduction of J8 No Clean Jetting Solder Paste. AIM has specifically formulated J8 No Clean Jetting Solder Paste for use in collaboration with a variety of jetting paste equipment manufacturers.

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AIM – Soldadura de Mexico Hosts Chihuahua Institute of Technology

AIM is pleased to announce that its Juarez, Mexico facility welcomed engineering students from the Chihuahua Institute of Technology (ITCH) to take a tour of its facility and learn about the key steps in the manufacturing process of solder assembly materials.

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AIM’S Technical Support Team Receives IPC-A-610 Certification

AIM is pleased to announce, twelve members of their global technical support team are now IPC-A-610 certified. All twelve members are officially Certified IPC specialists.

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AIM to Highlight M8 at SMTA Philadelphia Expo & Tech Forum

AIM is pleased to announce their participation at the SMTA Philadelphia Expo and Tech Forum, scheduled to take place June 9th, 2016 at the Radisson Hotel Valley Forge located in King of Prussia, Pennsylvania.

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AIM to Highlight M8 at SMTA Michigan Expo & Tech Forum on May 19th, 2016

AIM is pleased to announce their participation at the SMTA Michigan Expo and Tech Forum, May 19th, 2016 at the Laurel Manor located in Livonia, Michigan.

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AIM’s Mehran Maalekian Ph.D. to Present at ICSR Toronto 2016

Dr. Mehran Maalekian, AIM’s Research and Development Manager, will present his white paper “Development of Lead-Free High-Reliability Solder Alloy” at the International Conference on Soldering and Reliability in Toronto, Canada on May 10th, 2016.

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AIM’s Karl Seelig to Present SMTA Webtorial

AIM’s Vice President of Technology, Karl Seelig, will present in the SMTA webtorial “Solder Reflow Fundamentals - Understanding Thermal Profiles and Defect Mitigation.” The webtorial will take place on April 26th & 28th, 2016 from 1:00 – 2:30pm Est.

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AIM’s Dillon Zhu to Present White Paper at SMTA China East Technical Conference

AIM announces that Dillon Zhu, Regional Technical Support Manager, will present the second installment of the “Conformal Coating Over No Clean” paper written by Karl Seelig, Vice President of Technology and Timothy O’Neill, Technical Marketing Manager, at the SMTA China East Technical Conference.

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