AIM Solder is pleased to announce that Flopy Feng, Technical Support Engineer, will present at the SMTA China South Technology Conference on August 29th, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
AIM's Mehran Maalekian will present his white paper “Low Silver SAC-Bi Lead-Free Solder For Enhanced Reliability” at the International Conference on Soldering and Reliability (ICSR) in Ontario, Canada.
AIM is pleased to announce the introduction of J8 No Clean Jetting Solder Paste. AIM has specifically formulated J8 No Clean Jetting Solder Paste for use in collaboration with a variety of jetting paste equipment manufacturers.
AIM is pleased to announce that its Juarez, Mexico facility welcomed engineering students from the Chihuahua Institute of Technology (ITCH) to take a tour of its facility and learn about the key steps in the manufacturing process of solder assembly materials.
AIM is pleased to announce, twelve members of their global technical support team are now IPC-A-610 certified. All twelve members are officially Certified IPC specialists.
AIM is pleased to announce their participation at the SMTA Philadelphia Expo and Tech Forum, scheduled to take place June 9th, 2016 at the Radisson Hotel Valley Forge located in King of Prussia, Pennsylvania.
AIM is pleased to announce their participation at the SMTA Michigan Expo and Tech Forum, May 19th, 2016 at the Laurel Manor located in Livonia, Michigan.
Dr. Mehran Maalekian, AIM’s Research and Development Manager, will present his white paper “Development of Lead-Free High-Reliability Solder Alloy” at the International Conference on Soldering and Reliability in Toronto, Canada on May 10th, 2016.
AIM’s Vice President of Technology, Karl Seelig, will present in the SMTA webtorial “Solder Reflow Fundamentals - Understanding Thermal Profiles and Defect Mitigation.” The webtorial will take place on April 26th & 28th, 2016 from 1:00 – 2:30pm Est.