Specialty Materials Division

Solders for Photonic Packaging

AIM’s wide range of specialty joining materials includes indium, gold/tin, bismuth, cadmium and gallium based solder alloys for photonic packaging applications.

When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill the most unique and challenging component packaging applications. We offer solders for:

  • Fiber to Ferrule Soldering

  • Laser Die Attach

  • Hermetic Packaging & Sealing

  • Wetting & Sealing Laser Optics

  • Thermal Management

 

AIM’s Commonly Specified Solder Alloys Used in Photonic Packaging Applications

Alloy Composition

Melting Range (°C) Tensile Strength (ksi) Density(g/cm3) CTE (x10-8/°C)            Creep Resistance

80Au/20Sn

280

276

14.5

16

Excellent

88Au/12Ge

356

185

14.7

13

Excellent

96.5Sn/3.5Ag

221

38

7.36

21

High

95Sn/3.5Ag/1.5In

218

51

7.36

22

High

91Sn/9Zn

199

65

7.27

n/a

Good

63Sn/Pb37

183

32

8.40

25

Moderate

62Sn/Pb36/Ag2

179

46

8.41

27

High

CASTIN

217

40

7.30

40

High

SAC305

218

40

7.40

40

High

40In/60Pb

195-225

34.5

9.31

26

Moderate

70In/30Pb

160-174

23.8

8.19

28

Moderate

80In/Pb15/Ag5

148-149

17.5

7.85

26

Moderate

100In

156.7

2.5

7.31

29

Poor

97In/3Ag

146

5.5

7.38

22

Poor

52In/48Sn

118

11.9

7.30

24

Low

58Bi/42Sn

138

55

8.56

14

Moderate

40Bi/60Sn

138-170

n/a

8.12

14

Moderate

54Sn/26Pb/20In

138-150

n/a

8.10

25

Moderate

35.7Sn/35.7Pb/28.6Bi

100

24

9.34

20

Low

 

For more information on AIM's solder products for photonic packaging or have questions specific to your assembly process, please contact us