No Clean

AIM’s full line of no clean solder products includes solder pastes, liquid fluxes and cored wire solders. These products have been proven to provide excellent soldering results to the end user, with post-process residues safe to leave on most assemblies, including high-reliability and RF devices.

 M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 platform, M8 brings no clean solder paste to the next level. Developed in combination with T4 and finer mesh leaded and lead-free alloy powders,...
 FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated. FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering. FX16 provides...
 AIM’s J8 No Clean Jetting Solder Paste is specially formulated for use with jetting equipment providing consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed...
 NC277 Liquid Flux is a water-based VOC-Free flux that has performance and reliability characteristics equal or superior to many alcohol-based fluxes. A medium-solids/residue flux, NC277 has an exceptionally durable and powerful activator system making it ideally suited for high thermal mass...
 GLOW CORE solder wire is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues.  
 NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes.  Now manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes...
 NC258 Solder Paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions.  NC258 Solder Paste reduces defects such as voiding and head-in-pillow.  The superior wetting ability of NC258 results in bright, smooth and...
 NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under micro-BGAs. 
 The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes, while ensuring long stencil life, excellent transfer efficiencies and minimizes solder balling common to...
 NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. 
 NC520 is a general no clean paste for use with lead-free and tin/lead alloys . NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. 
 IPA-based flux for foaming or spraying applications. 
IPA-based, low-residue flux for spraying applications.
 NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC275LR offers a broad activation range, proving to be an excellent flux for a variety of process parameters and...
 NC280 is a low-to-medium solids, no-clean liquid flux formulated to leave minimal post-process residues that are pin testable without cleaning.  NC280 offers an excellent activity level with good performance on bare copper, solder coated and organic coated PWBs, leaving negligible...
 NC263UR is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to promote enhanced wetting during the wave soldering process. NC263UR has a higher activity level and lower surface tension than other no-clean liquid fluxes. NC263UR performs well with bare copper,...
 NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source.  NC217 Gel Flux is electrically safe even without a thermal profile.  This gel flux dries within one hour of use with or without heat and is tack-free after four hours.
 NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attaching spheres to ball grid array (BGA)...