News

December 02, 2007
Cranston, Rhode Island, USA - AIM is pleased to announce the development of One-Step Underfill 688, a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies...
October 18, 2004
Cranston, Rhode Island, USA - AIM has introduced 270WR, a VOC-free, no-clean liquid flux formulated to offer a broad process window for lead-free and tin-lead wave soldering applications. 270WR has proven to be an excellent flux for a variety of...
June 05, 2003
Cranston, Rhode Island, USA - AIM is pleased to announce the development of NC254 lead-free pin probe testable no-clean solder paste, designed to improve the throughput and increase the efficiency of the most advanced SMT applications.NC254 is...

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