Abstract. To successfully achieve lead-free electronics assembly, each participant in the manufacturing process, from purchasing to engineering to maintenance to Quality/Inspection, must have a solid understanding of the changes required of them. This pertains to considerations regarding design, components, PWBs, solder alloys, fluxe s, printing, reflow, wave soldering, rework, cleaning, equipment wear & tear and inspection.
Introduction. With the WEEE and RoHS Directive in Europe (in its most recent revision) potentially outlawing lead from electronics produced and imported in the EU as early as 2006 and foreign competition driving the implementation of lead-free electronics assembly around the world, additional questions regarding how manufacturers can successfully transition to lead-free assembly continue to arise. A great deal of consortia work and empirical data exists on lead-free soldering. What...