Technical Articles

This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing.

An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices.

This paper provides a comprehensive analysis of LT solder, particularly focusing on its application in rework processes and the broader implications for electronics manufacturing.

This paper addresses the rework concerns associated with low-temperature solders and provides guidance on rework materials and techniques for success.

In this study, AIM’s application lab attempts to bridge this gap by approximating a production environment in a multi-hour printing test. The focus? To quantify the effect of under-stencil wipe solvent on solder paste performance, we compared the commonly used isopropyl alcohol (IPA) with a novel stencil cleaner.