Technical Articles

A critical aspect of semiconductor fabrication involves the encapsulation of integrated circuits to protect them from physical damage and corrosion, while enhancing their performance and reducing size. The technology around this advanced semiconductor packaging (ASP) is pivotal not only for functionality but also for the economic viability of modern electronic devices. 

As components shrink in size, the demand for finer solder pastes increases. But the selection of solder paste is not just about matching component size, it’s also about optimizing printing and reflow processes to prevent defects and ensure reliability. 

The squircle combines the volumetric benefit of square apertures with the paste release benefits of rounded shapes, which also avoids regions of paste accumulation. It brings the best of both worlds to an extremely challenging part of the printing process. 

This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing.

An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the SMT reflow processes to solder through-hole devices.

This paper provides a comprehensive analysis of LT solder, particularly focusing on its application in rework processes and the broader implications for electronics manufacturing.

This paper addresses the rework concerns associated with low-temperature solders and provides guidance on rework materials and techniques for success.

In this study, AIM’s application lab attempts to bridge this gap by approximating a production environment in a multi-hour printing test. The focus? To quantify the effect of under-stencil wipe solvent on solder paste performance, we compared the commonly used isopropyl alcohol (IPA) with a novel stencil cleaner.