Tech Articles
Menu
Your Global Leader in Solder Technology
AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Effect of Under-stencil Wipe Chemistry on Solder Printing
In this study, AIM’s application lab attempts to bridge this gap by approximating a production environment in a multi-hour printing test. The focus? To quantify the effect of under-stencil wipe ...
Read Full Article