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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Identifying Solder Mask Problems with Simple Tests
In printed circuit board (PCB) assembly, solder mask integrity is paramount. This protective layer, designed to shield the copper surfaces and prevent solder bridging between components, plays a crucial role ...
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Reflow Profiling in Soldering and PCB Assembly
Verifying and optimizing the temperature profile of a reflow oven ensures an ideal thermal environment for solder paste to melt, flow, and solidify, forming robust solder joints.
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The Role of Solder in Advanced Semiconductor Packaging
A critical aspect of semiconductor fabrication involves the encapsulation of integrated circuits to protect them from physical damage and corrosion, while enhancing their performance and reducing size. The technology around ...
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Solder Paste Powder: When to Downsize
As components shrink in size, the demand for finer solder pastes increases. But the selection of solder paste is not just about matching component size, it’s also about optimizing printing ...
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Improving Solder Paste Printing With Squircle Aperture Designs
The squircle combines the volumetric benefit of square apertures with the paste release benefits of rounded shapes, which also avoids regions of paste accumulation. It brings the best of both ...
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