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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
IMPROVING SOLDER PASTE PRINTING WITH SQUIRCLE APERTURE DESIGNS
The squircle combines the volumetric benefit of square apertures with the paste release benefits of rounded shapes, which also avoids regions of paste accumulation. It brings the best of both ...
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Significant Reduction in QFN Voids with I/O Pad Overprinting
This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing.
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Pin-in-Paste (PIP) Assembly
An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the ...
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Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
This paper provides a comprehensive analysis of LT solder, particularly focusing on its application in rework processes and the broader implications for electronics manufacturing.
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Addressing Low-Temperature Rework Concerns
This paper addresses the rework concerns associated with low-temperature solders and provides guidance on rework materials and techniques for success.
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