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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Significant Reduction in QFN Voids with I/O Pad Overprinting
This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing.
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Pin-in-Paste (PIP) Assembly
An alternative technique for soldering through-hole components, eliminating the need for a separate soldering process, is the Pin-in-Paste (PiP) or Intrusive Reflow method. PiP utilizes solder paste printing and the ...
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Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
This paper provides a comprehensive analysis of LT solder, particularly focusing on its application in rework processes and the broader implications for electronics manufacturing.
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Addressing Low-Temperature Rework Concerns
This paper addresses the rework concerns associated with low-temperature solders and provides guidance on rework materials and techniques for success.
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Effect of Under-stencil Wipe Chemistry on Solder Printing
In this study, AIM’s application lab attempts to bridge this gap by approximating a production environment in a multi-hour printing test. The focus? To quantify the effect of under-stencil wipe ...
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