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AIM Solder Technical Articles
AIM Solder’s collection of technical articles provide insights, details, data, and studies on a wide variety of industry-pertinent topics, including alloy innovations, how to minimize voiding, rework bench chemistry, printing adjustments, and more.
Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly
This paper provides a comprehensive analysis of LT solder, particularly focusing on its application in rework processes and the broader implications for electronics manufacturing.
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Addressing Low-Temperature Rework Concerns
This paper addresses the rework concerns associated with low-temperature solders and provides guidance on rework materials and techniques for success.
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Effect of Under-stencil Wipe Chemistry on Solder Paste Print Performance
This study, performed by AIM Solder, analyzes the effect of under-stencil wipe chemistry on print performance, contrasting IPA with a novel cleaner.
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