Solders for Photonic Packaging
AIM’s wide range of specialty joining materials includes indium, gold/tin, bismuth, cadmium and gallium based solder alloys for photonic packaging applications.
When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill the most unique and challenging component packaging applications. We offer solders for:
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Fiber to Ferrule Soldering
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Laser Die Attach
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Hermetic Packaging & Sealing
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Wetting & Sealing Laser Optics
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Thermal Management | DOWNLOAD: AIM THERMAL MANAGEMENT MATERIALS BROCHURE
AIM’s Commonly Specified Solder Alloys Used in Photonic Packaging Applications
Alloy Composition |
Melting Range (°C) | Tensile Strength (ksi) | Density(g/cm3) | CTE (x10-8/°C) | Creep Resistance |
80Au/20Sn |
280 |
276 |
14.5 |
16 |
Excellent |
88Au/12Ge |
356 |
185 |
14.7 |
13 |
Excellent |
96.5Sn/3.5Ag |
221 |
38 |
7.36 |
21 |
High |
95Sn/3.5Ag/1.5In |
218 |
51 |
7.36 |
22 |
High |
91Sn/9Zn |
199 |
65 |
7.27 |
n/a |
Good |
63Sn/Pb37 |
183 |
32 |
8.40 |
25 |
Moderate |
62Sn/Pb36/Ag2 |
179 |
46 |
8.41 |
27 |
High |
CASTIN |
217 |
40 |
7.30 |
40 |
High |
SAC305 |
218 |
40 |
7.40 |
40 |
High |
40In/60Pb |
195-225 |
34.5 |
9.31 |
26 |
Moderate |
70In/30Pb |
160-174 |
23.8 |
8.19 |
28 |
Moderate |
80In/Pb15/Ag5 |
148-149 |
17.5 |
7.85 |
26 |
Moderate |
100In |
156.7 |
2.5 |
7.31 |
29 |
Poor |
97In/3Ag |
146 |
5.5 |
7.38 |
22 |
Poor |
52In/48Sn |
118 |
11.9 |
7.30 |
24 |
Low |
58Bi/42Sn |
138 |
55 |
8.56 |
14 |
Moderate |
40Bi/60Sn |
138-170 |
n/a |
8.12 |
14 |
Moderate |
54Sn/26Pb/20In |
138-150 |
n/a |
8.10 |
25 |
Moderate |
35.7Sn/35.7Pb/28.6Bi |
100 |
24 |
9.34 |
20 |
Low |
For more information on AIM's solder products for photonic packaging or have questions specific to your assembly process, please contact us.