Serviços de suporte técnico da AIM
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AIM Solder Analysis
Solder pots can become contaminated with other metals dissolved during the soldering process. These impurities can affect the physical characteristics and wetting ability of the solder, and may contribute to defects such as icicles, bridging, pinholes, webbing and non-wetting.
The AIM Solder Analysis Service Program provides exact information on the contents of a solder pot, increasing wave and selective soldering throughput, product reliability and ensures IPC compliance. Regularly scheduled solder pot analysis is recommended to track solder pot contamination, reduce solder consumption and dross formation.
AIM’s Solder Pot Analysis Program provides a J-STD-001 compliant report on solder pot composition for alloy maintenance or for solving specific solder-related problems. Samples are analyzed to determine concentrations of constituent elements and a variety of contaminants through the use of spark emission spectroscopy.
How to Order Solder Analysis Service
- Customer provides a purchase order for solder analysis envelopes and is billed accordingly.
- The envelopes are sent to the customer via USPS unless otherwise requested. For urgent requests envelopes are sent via FedEx or UPS at the customer’s expense.
- Customer sends in a solder sample for analysis in an authorized AIM Analysis envelope to the address provided. The solder sample should be 1″ wide x 2″ long or weigh 200 grams. See Tutoriais técnicos da AIM video “How to Collect Solder from a Solder Pot for Analysis” for sample collection procedure.