M8
NO CLEAN SOLDER PASTE
Recursos
- Excellent print transfer efficiencies on 01005s and >0.50 area ratios
- Formulated for use with T4 and finer powders
- Low voiding: <5% on BGAs and <10% on BTC components
- Eliminate s HiP (head-in-pillow) defects
- Minimal transparent residue – LED compliant
- Pin-testable
- Powerful wetting on lead-free surfaces
- Passes Bono and automotive SIR testing
- 8+ hour stencil life
- Disponível em ligas com e sem chumbo
- Conformidade com REACH e RoHS*
M8 No Clean Solder Paste
AIM engineered M8 No Clean Solder Paste for the most demanding applications, including automotive, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.
M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.
To guarantee the highest quality, AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.
*Ligas sem chumbo
M8: Powerful, Reliable, Adaptable
- Provides stable print performance for the most demanding, high density electronic assemblies
- Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
- Accommodates a wide range of profiling processes and techniques
- Reduces DPMO (Defects Per Million Opportunities)
- Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
- Available for printing and dispensing solder paste applications
| Ligas metálicas | Temperaturas de fusão (℃) | Peak Reflow Temperature Range (℃) | Atributos da liga |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - Excelentes características de umectação |
| REL61 | 208°C -215°C | 230°C-250°C | - Maior confiabilidade em comparação com ligas com pouca ou nenhuma prata - Alternativa de baixo custo às ligas SAC - Umectação aprimorada em comparação com ligas com pouca ou nenhuma prata |
| REL22 | 210°C -219°C | 230°C-250°C | • Enhanced/ High reliability for use in extremely harsh environments - Desempenho aprimorado de ciclagem térmica - Umectação aprimorada em comparação com ligas com pouca ou nenhuma prata |
| SN100C | 227°C | 240°C-260°C | - Alternativa de baixo custo às ligas SAC • Silver-Free - Juntas de solda brilhantes |
| Sn63/Pb37 | 183°C | 205°C-235°C | - Liga legada para soldagem de eletrônicos - Aprovado pela Mil-spec • Product contains Pb (leaded alloy) |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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