OAJ
WATER SOLUBLE CORED SOLDER WIRE
Recursos
- High activity level
- Reduces oxidation of solder iron tip
- Excellent thermal transfer
- Post-process residues cleaned with DI water
- Available in multiple lead-free and leaded alloys
- IPC flux classification: ORH1
OAJ Water Soluble Cored Solder Wire
OAJ Water Soluble Cored Solder wire is engineered with a neutralized amine halide-activated system that delivers powerful wetting performance on all surface finishes and plating. OAJ cored wire’s powerful flux system rapidly removes oxides and provides maximum capillary action for fast wetting and rapid solder penetration.
OAJ residue is designed to wash away easily with only DI water and residue must be removed post-soldering. OAJ’s IPC flux classification is ORH1. OAJ is available in multiple alloys such as SAC305 solder wire as well as Sn63/Pb37 solder wire.
AIM’s OAJ flux cored wire is appropriate for difficult to solder applications and can be used in aerospace, automotive, and industrial electronics when post-process cleaning is involved.
- Powerful wetting and rapid oxide removal
- Fast capillary action
- High activity flux cored solder wire
- Rapid solder penetration into plated through hole or surface mount interconnections
| Ligas metálicas | Temperaturas de fusão (℃) | Atributos da liga |
|---|---|---|
| SAC305 | 217°C -220°C | • Excellent wetting characteristics • Compatible with all flux types |
| Sn63/Pb37 | 183°C | - Liga legada para soldagem de eletrônicos - Aprovado pela Mil-spec - Liga com chumbo |
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