NC217
NO CLEAN GEL FLUX
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Recursos
- Formulated for Rework and Repair
- Ideal for BGAs: Wide Process Window
- Electrically Safe Unheated
- ROL0
- Controlled Application
- Easy to Clean Residue
- Passes SIR in Raw State
NC217 No Clean Gel Flux
Descrição do produto
Uso do aplicativo
Informações sobre os dados do produto
Documentos técnicos
Descrição do produto
NC217 No Clean Gel Flux is specifically formulated for rework of all types of surface mount components. Its gel-like consistency is engineered for easy touch-up and precise flux application.
Dried, NC217 flux residues pass IPC J-STD-004* SIR without additional heat and are tack-free in 2-4 hours. The powerful activator system of NC217 promotes wetting and shiny joints even on difficult to solder surfaces.
NC217 is compatible with AIM’s entire line of no clean solder paste, cored solder wire, and flux formulations, meeting IPC-610 flux requirements.
Uso do aplicativo
- Ideal for BGA rework/reballing and QFN/LGA repair
- Residues can be left on the board after soldering
• When cleaning is required, residues can be removed using common flux removers - Wide process window offers increased manufacturing flexibility
- Residues pass SIR without adding heat
• Ideal for automotive, medical, and aerospace applications - Tin-Lead and lead-free compatible
- Improved heat transfer results in reduced cycle time
- Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units
Informações sobre os dados do produto
| Tipo de fluxo | Applications | Application Method | Alloy Compatibility |
|---|---|---|---|
| ROL0 | BGA Sphere Attach Rework Component Removal | Dispense Dip | Pb and PB-Free |
Documentos técnicos
Se o documento de que você precisa não estiver listado abaixo, entre em contato com o representante local de atendimento ao cliente da AIM ou Entre em contato conosco para solicitar o documento.