V9 Low-Voiding Solder Paste

Features: 
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- REACH and RoHS* Compliant
- Available in SAC305 T4

 

V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values. 

*Lead-free alloys only