V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.

*lead-free alloys

• Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
• Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
• Electrochemical reliability fit for aerospace and military assemblies
• Wide process window: void reduction across a variety of reflow profiles

*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.

If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.

• V9 Product Line Card
• V9 TDS – English
• Look up SDS (Safety Data Sheets)