NC273LT Low Temperature
NO CLEAN SOLDER PASTE
Features
- Designed for low temperature solder applications
- Increased wetting attributes
- Reduce HiP (Head-in-Pillow) defects
- > 8-hour long stencil life
- Minimize solder balling
- Excellent transfer efficiencies
- RoHS compliant
NC273LT Low Temperature Solder Paste
AIM’s NC273LT Low Temperature Solder Paste features a revolutionary activator system that enhances wetting performance, prolongs stencil life, and achieves excellent transfer efficiencies. Additionally, it effectively minimizes solder balling, a common issue with high bismuth materials.
Low temperature solder materials like NC273LT also decrease peak reflow temperature requirements to as low as 170°C to 175°C (340°F to 350°F). This reduction in temperature leads to cost savings, lower CO2 emissions, and reduced HiP defects.
*lead-free alloys
- Reduces BGA warpage, which minimizes HiP and NWO (Non-Wet Open) defects
- Lowers process temperatures for thin or temperature sensitive components
- Used in step soldering or second-solder reflow applications to exploit the different melting temperatures of two alloys
- Reduces carbon footprint and energy costs
- Lowers material and component costs
| Alloys | Melting Temperatures (℃) | Peak Reflow Temperature Range (℃) | Alloy Attributes |
|---|---|---|---|
| Sn42/Bi58 | 138°C | 163°C-188°C | • High purity • Eutectic alloy • Low melting temperature |
| Sn42/Bi57/Ag1 | 138°C- 140°C | 163°C-188°C | • High purity • Low melting temperature • Addition of Ag increases ductility |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.