Sn63/Pb37
LEADED SOLDER ALLOY
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Features
- High Purity
- Manufactured with AIM Electropure™ Process
- Reduces Dross
- High Reliability
- Excellent Thermal Cycling Performance
- Exceeds IPC-J-STD-006 Specifications
Sn63/Pb37 Leaded Solder Alloy
Product Description
Application Use
Product Data Info
Technical Documents
Product Description
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. AIM’s Electropure proprietary method reduces oxides in the solder resulting in a low drossing, strong wetting alloy with improved flow.
Sn63/Pb37 has a melting point of 183°C (361°F) which can be used in SMT, wave, selective and hand soldering processes. Its resistance to thermal fatigue makes it preferred for military and aerospace applications.
Sn63/Pb37 is available in solder paste, solder bar, solid and cored solder wire.
Application Use
- Excellent resistance to thermal fatigue
- Preferred for aerospace and military applications
- Eutectic alloy: bright, shiny solder joints
- Melting temperature: 183°C
- Leaded solder paste available in T4
Product Data Info
| Composition | Melting Temperatures (℃) | Peak Reflow Temperature (℃) | Cost Level |
|---|---|---|---|
| Sn/Pb | 183°C | 205°C – 215°C | $ |
Technical Documents
If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.