Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue characteristics versus Sn42/Bi58. It is composed of 42% tin, 57% bismuth and 1% silver.

Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys, reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).

Sn42/Bi57/Ag1 is available with specially formulated fluxes to ensure electrochemical reliability even with reduced soldering temperatures.

• Lead-free low melt alloy
• Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
• Reduces NOW/HiP defects on temperature sensitive components
• Good wetting performance required for quick, post-assembly attachments

If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.

• Sn42/Bi57/Ag1 TDS – English
• Look up SDS (Safety Data Sheets)