SN100C
LEAD-FREE SOLDER ALLOY
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Features
- Produces Smooth, Bright Solder Joints
- Cost Saving Alloy
- Melting Point: 227°C
- Does Not Contain Silver
- Minimizes Copper Erosion from Holes, Pads and Tracks
- Solder Dross Rate Similar to Sn-Pb Alloys
- Manufactured with AIM Electropure™ Technology
- Complies with IPC J-STD-006
SN100C Lead-Free Solder Alloy
Product Description
Application Use
Product Data Info
Technical Documents
Product Description
SN100C® Electropure™ is a high purity, silver-free alloy containing tin-copper-nickel + germanium. SN100C outperforms SAC lead-free alloys at a much lower cost.
SN100C has a proven history as a reliable, cost-effective lead-free/silver-free alloy and is preferred by automotive, military, aerospace and LED industries.
AIM’s Electropure process reduces oxides resulting in a low drossing, strong wetting alloy with improved flow.
SN100C is available in bar, wire, and solder paste.
Application Use
- Eutectic alloy eliminates frosty appearance
- Eliminates hot tears
- Reduces voiding vs SAC305
Product Data Info
| Composition | Melting Temperature (℃) | Peak Reflow Temperature Range (℃) | Cost Level |
|---|---|---|---|
| S/Cu/Ni+Ge | 227°C | 230°C – 245°C | $$ |
Technical Documents
If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.