AIM’s RMA258-15R Rosin-Based Solder Paste is specifically formulated to cater to the military, space, and aerospace markets. This solder paste efficiently combines the demands of high-reliability performance, meeting legacy specifications, with the capabilities of modern solder pastes.

RMA258-15R ensures stable print definitions and boasts long pause-to-print capabilities. It effectively minimizes voiding, HiP, and NWO defects, enhancing the overall reliability of soldered joints. The superior wetting characteristics of RMA258-15R are observed with both leaded and lead-free alloys, resulting in bright, smooth, and shiny solder joints.

This solder paste excels in exceptional reflow performance, even during long, hot profiles. After reflow, it leaves amber-colored post-reflow residues, which are specifically designed for removal in saponified batch, in-line, or solvent wash processes.

• Provides excellent wetting capabilities on difficult to solder surfaces
• Wide reflow process window
• ROL0 flux classification per IPC J-STD-004
• Minimizes voiding
• Eliminates non-wet opens (NWO) and head-in-pillow defects (HiP)
• Flux system designed for high reliability assemblies such as military and aerospace applications
• Offers stable print performance on fine pitch print deposits

*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.

If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.

• RMA258-15R TDS – English
• Look up SDS (Safety Data Sheets)