WS488 WATER SOLUBLE SOLDER PASTE Features Halide/Halogen-Free Excellent Wetting Low BTC and BGA Voiding High Reliability Print Capability to 0.50 Area Ratio with T4 Available in Multiple Lead-Free Alloys REACH and RoHS Compliant* WS488 Water Soluble Solder Paste Product Description Application Use Product Data Info Technical Documents Product Description AIM formulated WS488 Water Soluble Solder […]
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W20 WATER SOLUBLE SOLDER PASTE Features Zero halide & halogen per current Rev J-STD-004 8+ hour stencil life Low voiding on QFN and BGA’s Easy to clean residues using DI water Extended cleaning window of 2+ weeks Low foaming formulation Wide reflow process window Available in SAC305 RoHS Compliant* W20 Water Soluble Solder Paste Product
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V9 Low Voiding NO CLEAN SOLDER PASTE Features Low Voiding: as low as 1% on BGA and
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NC273LT Low Temperature NO CLEAN SOLDER PASTE Features Designed for low temperature solder applications Increased wetting attributes Reduce HiP (Head-in-Pillow) defects > 8-hour long stencil life Minimize solder balling Excellent transfer efficiencies RoHS compliant NC273LT Low Temperature Solder Paste Product Description Application Use Product Data Info Technical Documents Product Description AIM’s NC273LT Low Temperature Solder
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NC257MD Jet Printing NO CLEAN SOLDER PASTE Features Engineered for use with Mycronic jet printers For use with Mycronic AG type ejector Clear, pin-testable residues 8-12 hour tack time Excellent wetting characteristics, even on leadless devices Vapor phase compatible Reduces voiding under micro-BGAs Prolongs ejector/cassette life NC257MD No Clean Solder Paste Product Description Application Use
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M8 NO CLEAN SOLDER PASTE Features Excellent print transfer efficiencies on 01005s and >0.50 area ratios Formulated for use with T4 and finer powders Low voiding:
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H10 Halogen-Free NO CLEAN SOLDER PASTE Features Halide/Halogen-Free Excellent Wetting Low BTC and BGA Voiding High Reliability Print Capability to 0.50 Area Ratio with T4 Available in Multiple Lead-Free Alloys REACH and RoHS Compliant* H10 Halogen-Free No Clean Solder Paste Product Description Application Use Product Data Info Technical Documents Product Videos Product Description H10 Halogen-Free
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J8 No Clean Jetting Solder Paste NO CLEAN SOLDER PASTE Features Capable of 200μm deposits Available in type 6 powder Compatible with AIM no clean solder pastes Passes Bono testing Reduced voiding:
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