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Sn63/Pb37 LEADED SOLDER ALLOY Features High Purity Manufactured with AIM Electropure™ Process Reduces Dross High Reliability Excellent Thermal Cycling Performance Exceeds IPC-J-STD-006 Specifications Sn63/Pb37 Leaded Solder Alloy Product Description Application Use Product Data Info Technical Documents Product Description Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. AIM’s […]

Sn42/Bi57/Ag1 LOW TEMPERATURE LEAD-FREE SOLDER ALLOY Features Manufactured with AIM Electropure™ Technology Good Fatigue Characteristics Improved Wetting Low Temp Alloy: Melting Point:138°C RoHS Compliant Complies with IPC J-STD-006 Sn42/Bi57/Ag1 Low Temperature Alloy Product Description Application Use Product Data Info Technical Documents Product Description Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue

SAC305 LEAD-FREE SOLDER ALLOY​ Features Cost Effective Sn/Ag/Cu Alloy Excellent Solder Joint Reliability Best Wetting Sn/Ag/Cu Alloy Manufactured with AIM Electropure™ Technology Global Standard Lead-Free Alloy Complies with IPC, JEDEC, RoHS, and REACH Pb-free soldering standards SAC305 Lead-Free Solder Alloy Product Description Application Use Product Data Info Technical Documents Product Description SAC305 Electropure is a

REL61™ LEAD-FREE SOLDER ALLOY Features Cost Saving SAC Alloy Enhanced Reliability Versus SAC and All Low/No-Silver Alloys Improved Thermal Cycling Performance Improved Wetting Versus All Low/No-Silver Alloys Aids in AOI First Pass Yields Proven Tin Whisker Mitigation Lower Process Temperature Complies with IPC J-STD-006 REL61 Lead-Free Solder Alloy Product Description Application Use Product Data Info

REL22™ LEAD-FREE SOLDER ALLOY Features High Reliability Enhanced Thermal Cycling Performance and Mechanical Durability vs. All SAC Alloys Wide Assembly Process Window vs. Competitive High Reliability Alloys Mitigates Tin Whisker Formation Improved Wetting Versus All Low/No-Silver Alloys For use in Lead-Free Process Only REL22 Lead-Free Solder Alloy Product Description Application Use Product Data Info Technical

WS482 WATER SOLUBLE CORED SOLDER PASTE Features Halide-Free High activity Excellent wetting Residues cleaned with DI water alone Extended cleaning times – safe up to 7 days Extends iron tip life Improved thermal transfer IPC J-STD-004C classification: ORM0 WS482 Water Soluble Cored Solder Wire Product Description Application Use Product Data Info Technical Documents Product Description

RX18 NO CLEAN CORED SOLDER WIRE​ Features Low voids Low spatter Extends solder tip life ROL0 per IPC J-STD-004 Fast wetting/feed rates Minimal/clear residues Available in leaded and lead-free alloy REACH and RoHS Compliant* RX18 No Clean Cored Solder Wire Product Description Application Use Product Data Info Technical Documents Product Description RX18 No Clean Cored

RMA ROSIN CORE SOLDER WIRE Features Rosin Mildly Activated Flux Fast Wetting Good Activity Level Easily Cleaned High Thermal Transfer ROL0 per J-STD-004 RMA Rosin Core Solder Wire Product Description Application Use Product Data Info Technical Documents Product Description RMA Rosin Core Solder Wire is the manufacturers’ choice for mildly activated, general-purpose rosin solder wire,

OAJ WATER SOLUBLE CORED SOLDER WIRE Features High activity level Reduces oxidation of solder iron tip Excellent thermal transfer Post-process residues cleaned with DI water Available in multiple lead-free and leaded alloys IPC flux classification: ORH1 OAJ Water Soluble Cored Solder Wire Product Description Application Use Product Data Info Technical Documents Product Description OAJ Water

WS716 WATER SOLUBLE LIQUID FLUX Features Halide/Halogen-Free ORH0 per J-STD-004 Current Rev Rosin-Free Enhanced Activity Level Does Not Foam in Washer Can be Foamed, Sprayed, Brushed, or Dipped WS716 Water Soluble Liquid Flux Product Description Application Use Product Data Info Technical Documents Product Description WS716 Water Soluble Liquid Flux is halogen-free and designed specifically for