NC217 No Clean Gel Flux is specifically formulated for rework of all types of surface mount components. Its gel-like consistency is engineered for easy touch-up and precise flux application.

Dried, NC217 flux residues pass IPC J-STD-004* SIR without additional heat and are tack-free in 2-4 hours. The powerful activator system of NC217 promotes wetting and shiny joints even on difficult to solder surfaces.

NC217 is compatible with AIM’s entire line of no clean solder paste, cored solder wire, and flux formulations, meeting IPC-610 flux requirements.

• Ideal for BGA rework/reballing and QFN/LGA repair
• Residues can be left on the board after soldering
  • When cleaning is required, residues can be removed using common flux removers
• Wide process window offers increased manufacturing flexibility
• Residues pass SIR without adding heat
  • Ideal for automotive, medical, and aerospace applications
• Tin-Lead and lead-free compatible
• Improved heat transfer results in reduced cycle time
• Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units

If the document you need is not listed below, please contact your local AIM Customer Service Rep or contact us to request the document.

• NC217 TDS – English
• Look up SDS (Safety Data Sheets)