Sn42/Bi58 is a low melting temperature alloy composed of 42% tin, 58% bismuth. Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).

Sn42/Bi58 alloy is available with specially formulated fluxes to ensure solder joint integrity and high electrochemical performance, even at reduced reflow temperatures.

• Lead-free low melt alloy
• Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
• Reduces NOW/HiP defects on temperature sensitive components
• Good wetting performance required for quick, post-assembly attachments

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• Sn42/Bi58 TDS - Angielski
• Sn42/Bi58 SDS – Americas English
• Sn42/Bi58 SDS – Europe English
• Sn42/Bi58 SDS – Asia English