SAC305
LEAD-FREE SOLDER ALLOY
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Cechy
- Cost Effective Sn/Ag/Cu Alloy
- Excellent Solder Joint Reliability
- Best Wetting Sn/Ag/Cu Alloy
- Manufactured with AIM Electropure™ Technology
- Global Standard Lead-Free Alloy
- Complies with IPC, JEDEC, RoHS, and REACH Pb-free soldering standards
SAC305 Lead-Free Solder Alloy
Opis produktu
Zastosowanie
Informacje o danych produktu
Dokumenty techniczne
Opis produktu
SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy.
SAC305 is widely used in hand, selective, wave and SMT soldering. SAC305 provides durable joint strength and the lowest melting point of tin/silver/copper solders.
SAC305 alloy is available in solder wire, solder bar, and solder paste.
Zastosowanie
- AIM’s Electropure technology reduces solder drossing, improves flow and reduces bridging
- IPC/JEIDA/IEC/EIN recommended alloy for lead-free soldering
- Suitable for a wide variety of applications
- SAC305 melting point: 217-220°C
- Popular in consumer and automotive applications
Informacje o danych produktu
| Composition | Melting Temperature (℃) | Peak Reflow Temperature Range (℃) | Cost Level |
|---|---|---|---|
| Sn/Ag/Cu | 217°C – 220°C | 240°C – 250°C | $$$ |
Dokumenty techniczne
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