NC273LT Low Temperature
NO CLEAN SOLDER PASTE
Cechy
- Designed for low temperature solder applications
- Increased wetting attributes
- Reduce HiP (Head-in-Pillow) defects
- > 8-hour long stencil life
- Minimize solder balling
- Excellent transfer efficiencies
- RoHS compliant
NC273LT Low Temperature Solder Paste
AIM’s NC273LT Low Temperature Solder Paste features a revolutionary activator system that enhances wetting performance, prolongs stencil life, and achieves excellent transfer efficiencies. Additionally, it effectively minimizes solder balling, a common issue with high bismuth materials.
Low temperature solder materials like NC273LT also decrease peak reflow temperature requirements to as low as 170°C to 175°C (340°F to 350°F). This reduction in temperature leads to cost savings, lower CO2 emissions, and reduced HiP defects.
*Stopy bezołowiowe
- Reduces BGA warpage, which minimizes HiP and NWO (Non-Wet Open) defects
- Lowers process temperatures for thin or temperature sensitive components
- Used in step soldering or second-solder reflow applications to exploit the different melting temperatures of two alloys
- Reduces carbon footprint and energy costs
- Lowers material and component costs
| Stopy | Temperatury topnienia (℃) | Peak Reflow Temperature Range (℃) | Atrybuty stopu |
|---|---|---|---|
| Sn42/Bi58 | 138°C | 163°C-188°C | • High purity • Eutectic alloy • Low melting temperature |
| Sn42/Bi57/Ag1 | 138°C- 140°C | 163°C-188°C | • High purity • Low melting temperature • Addition of Ag increases ductility |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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- NC273LT Product Line Card
- NC273LT TDS - Angielski
- Sprawdź SDS (Karty charakterystyki)