Solder pastes with ultra fine alloy powders, such as T6 or finer, are essential for a range of emerging and advanced applications where precision, reliability, and miniaturization are paramount.

AIM’s NC259FPA Ultrafine No Clean Solder Paste is formulated specifically for Type 6 and finer solder powders. This solder paste offers efficient transfer rates and precise print definition. The NC259FPA activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.