CRANSTON, RHODE ISLAND, U.S.A. ― AIM Solder, a leading global manufacturer of assembly materials for the electronics industry, announces that Karl Seelig, AIM’s Vice President of Technology, is scheduled to present “Sample Preparation for Mitigating Tin Whiskers in Alternative Lead Free Alloys” at the 2014 IPC APEX Expo in Las Vegas, NV held March 25th - 27th. The presentation is scheduled on Wednesday, March 26th 10:00 am – 12:00 pm, during session S14: Solder Mixing/ Reliability in the Mandalay Bay Resort and Convention Center.
The intention of this paper is to investigate the issue of tin whisker growth, one of the many concerns regarding lead-free soldering in high reliability electronics. Seelig examines the results of test data collected over time, showing typical tin whisker growth of the different lead-free alloys tested. The presentation includes tin whisker growth research and the results of several developed and modified lead-free alloys tested,subsequently demonstrating how the different alloy compositions could potentiality relate to tin whisker mitigation.
In his more than 30 years of industry experience, Karl Seelig has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly and process optimization, inspection, and metallurgical studies. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He also has received numerous patents in soldering technology, including four lead-free solder alloys.
Additionally, AIM Solder will be exhibiting at the IPC APEX Expo. Please visit booth 1217 for the latest in soldering technology materials and applications advice.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.
Upcoming Events:
March 23-27, 2014 – IPC APEX, Booth No. 1217 – Las Vegas, NV
April 23-25, 2014 – NEPCON China – Shanghai China
May 6-8, 2014 - SMT Hybrid Packaging 2014 – Nuremburg, Germany
