Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is proud to announce that its groundbreaking product, NC259FPA Ultrafine No Clean Solder Paste, has been honored with the 2024 Circuits Assembly NPI Award for solder materials. This accolade is a testament to AIM Solder’s commitment to innovation and excellence in the electronics manufacturing industry.
The Circuits Assembly NPI Awards recognize the leading new products for electronics assembly during the past year. Winning this award underscores AIM Solder’s dedication to developing products that advance the electronics manufacturing sector, meet the evolving needs of our customers, and set new standards for quality and reliability.
The NC259FPA is a zero-halogen solder paste, specifically engineered to meet the demanding requirements of miniLED, microLED, die attach, micro BGA, and HDI board applications. Its formulation allows for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter, setting a new industry standard in miniaturization and precision.
Key features of the NC259FPA Ultrafine No Clean Solder Paste include:
- Excellent Wetting: Ensures strong, reliable joints for long-term performance.
- High Transfer Efficiency: Optimizes material usage and reduces waste, making it a cost-effective solution.
- High Reliability: Meets the rigorous standards required in high-performance electronics manufacturing.
- High Tack Force for Mass Transfer: Ideal for intricate miniLED and microLED applications.
“We are incredibly proud to receive the 2024 Circuits Assembly NPI Award,” said Timothy O’Neil, Director of Product Management at AIM Solder. “This award is a reflection of our team’s hard work, dedication, and relentless pursuit of excellence. We remain committed to providing our customers with superior products and services, and this recognition further motivates us to continue innovating and exceeding industry standards.”
For more information about AIM Solder’s NC259FPA Ultrafine No Clean Solder Paste and other products, please visit www.aimsolder.com.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.
