Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce its participation in the SMTA International 2024 conference, taking place October 20-24 at the Donald E. Stephens Convention Center in Rosemont, IL.
AIM Solder will be exhibiting at Booth #2725, where attendees can explore the company’s latest innovations, including the award-winning NC259FPA Ultrafine No Clean Solder Paste, and engage with AIM’s team of experts.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
AIM Solder Content Specialist, Gayle Towell will also be sharing expertise across several key sessions during the conference:
- Women’s Leadership Program: Round Table Discussion Host; Past, Present, Future of Soldering Technologies, Monday, October 21, 4:00 PM | This discussion will focus on the evolution of soldering technologies, providing insights and fostering dialogue among industry leaders.
- Technical Presentation: Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys, Tuesday, October 22, 3:30 PM, Session INS4, Room 44 | This presentation will delve into a comparative study of AOI systems’ performance on printed circuit boards soldered with SAC305 and REL61™ alloys. The research explores how REL61™’s uniform matte finish potentially enhances AOI performance by producing more uniform fillets, wetting, and distribution.
- UltraHDI Pavilion: Ultrafine Solder Paste, Wednesday, October 23 | Gayle Towell will be presenting on the latest advancements in ultrafine solder paste technology.
- Special Session with SMTA: Innovating Education, Thursday, October 24 | A panel of SMTA members unveil a new video course format for workforce education within the electronics manufacturing industry.
With master’s degrees in mathematics and physics from the University of Oregon, Gayle Towell brings nearly two decades of experience in higher education, technical writing, and creative writing to her work at AIM Solder. Gayle is instrumental in producing technical and research-based materials, while also collaborating with industry partners on various projects.
AIM Solder invites all SMTAI attendees to visit Booth #2725 to learn more about our superior soldering products and how our technical expertise can support your manufacturing processes. We look forward to engaging with industry professionals and exploring collaborative opportunities.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.