V9 Low Voiding
NO CLEAN SOLDER PASTE
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![](https://www.aimsolder.com/wp-content/uploads/No-Clean-LF-Paste-500g-Jar-300x300.gif)
Caractéristiques
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- Available in SAC305 T4
- Conformité REACH et RoHS*
V9 Low Voiding No Clean Solder Paste
Description du produit
Utilisation de l'application
Données sur le produit
Documents techniques
Product Videos
Description du produit
V9 Low Voiding No Clean Solder Paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction is achievable on all surface finishes including ENIG, immersion tin/silver and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
*alliages sans plomb
Utilisation de l'application
- Reduced voiding aids in thermal dissipation resulting in a low junction temperature for rapid cycling devices such as LED lighting
- Excellent print transfer and near-zero voiding exceed strict automotive OEMs and tier 1 supplier requirements
- Electrochemical reliability fit for aerospace and military assemblies
- Wide process window: void reduction across a variety of reflow profiles
Données sur le produit
Alliages | Températures de fusion (℃) | Peak Reflow Temperature Range (℃) | Attributs de l'alliage |
---|---|---|---|
SAC305 | 217°C -220°C | 230°C-260°C | - Excellentes caractéristiques de mouillage - Compatible avec tous les types de flux |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
Documents techniques
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Product Videos