M8
NO CLEAN SOLDER PASTE
Caractéristiques
- Excellent print transfer efficiencies on 01005s and >0.50 area ratios
- Formulated for use with T4 and finer powders
- Low voiding: <5% on BGAs and <10% on BTC components
- Eliminate s HiP (head-in-pillow) defects
- Minimal transparent residue – LED compliant
- Pin-testable
- Powerful wetting on lead-free surfaces
- Passes Bono and automotive SIR testing
- 8+ hour stencil life
- Disponible en alliages avec ou sans plomb
- Conformité REACH et RoHS*
M8 No Clean Solder Paste
AIM engineered M8 No Clean Solder Paste for the most demanding applications, including automobile, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.
M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.
To guarantee the highest quality, AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.
*alliages sans plomb
M8: Powerful, Reliable, Adaptable
- Provides stable print performance for the most demanding, high density electronic assemblies
- Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
- Accommodates a wide range of profiling processes and techniques
- Reduces DPMO (Defects Per Million Opportunities)
- Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
- Available for printing and dispensing solder paste applications
| Alliages | Températures de fusion (℃) | Peak Reflow Temperature Range (℃) | Attributs de l'alliage |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - Excellentes caractéristiques de mouillage |
| REL61 | 208°C -215°C | 230°C-250°C | - Fiabilité accrue par rapport aux alliages à faible teneur en argent ou sans argent - Alternative peu coûteuse aux alliages SAC - Mouillage amélioré par rapport aux alliages à faible teneur en argent ou sans argent |
| REL22 | 210°C -219°C | 230°C-250°C | • Enhanced/ High reliability for use in extremely harsh environments - Amélioration des performances en matière de cycles thermiques - Mouillage amélioré par rapport aux alliages à faible teneur en argent ou sans argent |
| SN100C | 227°C | 240°C-260°C | - Alternative peu coûteuse aux alliages SAC • Silver-Free - Joints de soudure brillants |
| Sn63/Pb37 | 183°C | 205°C-235°C | - Alliage Legacy pour le brasage électronique - Approuvé selon les normes militaires • Product contains Pb (leaded alloy) |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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