SN100C
LEAD-FREE SOLDER ALLOY
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Caractéristiques
- Produces Smooth, Bright Solder Joints
- Cost Saving Alloy
- Melting Point: 227°C
- Does Not Contain Silver
- Minimizes Copper Erosion from Holes, Pads and Tracks
- Solder Dross Rate Similar to Sn-Pb Alloys
- Manufactured with AIM Electropure™ Technology
- Complies with IPC J-STD-006
SN100C Lead-Free Solder Alloy
Description du produit
Utilisation de l'application
Données sur le produit
Documents techniques
Description du produit
SN100C® Electropure™ is a high purity, silver-free alloy containing tin-copper-nickel + germanium. SN100C outperforms SAC lead-free alloys at a much lower cost.
SN100C has a proven history as a reliable, cost-effective lead-free/silver-free alloy and is preferred by automotive, military, aerospace and LED industries.
AIM’s Electropure process reduces oxides resulting in a low drossing, strong wetting alloy with improved flow.
SN100C is available in bar, wire, and solder paste.
Utilisation de l'application
- Eutectic alloy eliminates frosty appearance
- Eliminates hot tears
- Reduces voiding vs SAC305
Données sur le produit
| Composition | Melting Temperature (℃) | Peak Reflow Temperature Range (℃) | Cost Level |
|---|---|---|---|
| S/Cu/Ni+Ge | 227°C | 230°C – 245°C | $$ |
Documents techniques
Si le document dont vous avez besoin ne figure pas dans la liste ci-dessous, veuillez contacter votre représentant local du service clientèle d'AIM ou nous contacter pour demander le document.