RMA258-15R
ROSIN BASED SOLDER PASTE
Caractéristiques
- Ideal for military, aerospace applications
- Modern RMA solder paste capabilities in a rosin-based formula
- ROL0 IPC flux classification
- Superior wetting characteristics
- Enhanced print definition on fine feature devices
- Long stencil life
- Easy cleaning in saponified water or solvent
- No white residue
- Reduces voiding and eliminates HiP (Head-in-Pillow) defects
- J-STD-001/J-STD-004 compliant
- Compatible with leaded and lead-free alloys
RMA258-15R Rosin-Based Solder Paste
AIM’s RMA258-15R Rosin-Based Solder Paste is specifically formulated to cater to the military, space, and aerospace markets. This solder paste efficiently combines the demands of high-reliability performance, meeting legacy specifications, with the capabilities of modern solder pastes.
RMA258-15R ensures stable print definitions and boasts long pause-to-print capabilities. It effectively minimizes voiding, HiP, and NWO defects, enhancing the overall reliability of soldered joints. The superior wetting characteristics of RMA258-15R are observed with both leaded and lead-free alloys, resulting in bright, smooth, and shiny solder joints.
This solder paste excels in exceptional reflow performance, even during long, hot profiles. After reflow, it leaves amber-colored post-reflow residues, which are specifically designed for removal in saponified batch, in-line, or solvent wash processes.
- Provides excellent wetting capabilities on difficult to solder surfaces
- Wide reflow process window
- ROL0 flux classification per IPC J-STD-004
- Minimizes voiding
- Eliminates non-wet opens (NWO) and head-in-pillow defects (HiP)
- Flux system designed for high reliability assemblies such as military and aerospace applications
- Offers stable print performance on fine pitch print deposits
| Alliages | Températures de fusion (℃) | Peak Reflow Temperature Range (℃) | Attributs de l'alliage |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - Excellentes caractéristiques de mouillage - Compatible avec tous les types de flux • Lead-free alloy |
| Sn63/Pb37 | 183°C | 215°C-225°C | • Legacy alloy for high reliability applications - Alliage au plomb • J-STD-001 complaint |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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