REL22™
LEAD-FREE SOLDER ALLOY
Caractéristiques
- High Reliability
- Enhanced Thermal Cycling Performance and Mechanical Durability vs. All SAC Alloys
- Wide Assembly Process Window vs. Competitive High Reliability Alloys
- Atténue la formation de whiskers d'étain
- Improved Wetting Versus All Low/No-Silver Alloys
- For use in Lead-Free Process Only
REL22 Lead-Free Solder Alloy
AIM’s REL22™ Lead-Free Solder Alloy is engineered to provide high reliability soldering in harsh service environments. REL22’s enhanced mechanical properties and thermal cycling properties are proven to increase reliability of QFN and leadless components versus SAC Alloys.
REL22 has been subjected to reliability testing required for use in automotive, aerospace and high-power LED applications. Testing shows REL22 reduces tin whisker formation and when used in through-hole soldering, REL22 produces the least solder dross compared to competing and SAC alloys in selective and wave soldering processes.
REL22 High Reliability Solder Alloy was awarded Circuits Assembly’s New Product Introduction (NPI) Award at IPC APEX.
REL22 is available in solder paste, cored solder wire, and solder bar.
- For use in applications where thermal exposure, vibration and high mechanical stress are a concern
- Superior thermal cycling performance
- Enhanced QFN reliability in SMT soldering
- Proven tin whisker mitigation
- Excellent wetting for 100% barrel-fill on all surface finishes
| Composition | Températures de fusion (℃) | Peak Reflow Temperature Range (℃) | Cost Level |
|---|---|---|---|
| Sn/Cu/Ag/Bi/Ni/Sb/X | 210°C -212°C | 240°C-250°C | $$$ |
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