NC Paste Flux
NO CLEAN PASTE FLUX
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Caractéristiques
- Used for BGA Ball Attach, SMT Rework and Component Removal
- Halide/Halogen-Free
- Excellent Wetting
- Low Voiding
- ROL0 per J-STD-004A/B/C
- Compliant to IPC 7711-7721 Rework/Repair Modification
NC Paste Flux
Description du produit
Utilisation de l'application
Données sur le produit
Documents techniques
Description du produit
NC Paste Flux is a halide/halogen-free no clean flux designed to wet solderable electronic surfaces, components, assemblies, and substrates.
NC Paste Flux is a tacky flux that may be used for general rework of printed circuit boards and for attaching spheres to ball grid array (BGA) packages.
NC Paste Flux residues do not require removal and can be left in place with excellent electrochemical performance.
Utilisation de l'application
- Excellent rework flux
- Residues are no clean, but can be cleaned with commercial flux removers, when required
- ROL0 per IPC-J-STD-004A/B/C
- Can be dispensed, printed, or dipped
- For use with leaded and lead-free alloys
Données sur le produit
| Type de flux | Applications | Application Method | Alloy Compatibility |
|---|---|---|---|
| ROL0 | BGA Sphere Attach Rework Component Removal |
Dispense Dip |
Pb and PB-Free |
Documents techniques
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