NC280
NO CLEAN LIQUID FLUX
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Caractéristiques
- Passes SIR Unheated
- Low Residue/Low Odor
- Specially Formulated for Rework
- Extends Tip Life
- Excellent Wetting
- Halide-Free per J-STD-004*
- Conformité REACH et RoHS*
- Lead-Free Compatible
NC280 No Clean Liquid Rework Flux
Description du produit
Utilisation de l'application
Données sur le produit
Documents techniques
Product Videos
Description du produit
NC280 No Clean Liquid Rework Flux’s unique formulation passes IPC-J-STD-004* without thermal exposure, making it an ideal choice for hand soldering and wire tinning applications.
NC280’s exceptional wetting performance complements AIM flux cored wire solders, improving solder quality and operator satisfaction.
NC280 leaves low residue and passes SIR testing unheated, reducing electrochemical failures due to inactivated flux residue
Utilisation de l'application
- Can be dispensed, dipped or sprayed.
- Designed for rework and tinning
- Excellent activity to promote wetting on bare copper and aged components and substrates
- Low residue: low-to-medium solids content
- Wide process window: Increases quality, speed and safety
- No clean flux: electrochemically safe without adding heat
- NC280 residues can be easily removed with commercial flux cleaners
Données sur le produit
| Type de flux | Applications | Application Method | Alloy Compatibility |
|---|---|---|---|
| ROL0 | Benchtop Rework Wire Tinning | Dispense Dip | Pb and PB-Free |
Documents techniques
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Product Videos