NC257MD Jet Printing
NO CLEAN SOLDER PASTE
Caractéristiques
- Engineered for use with Mycronic jet printers
- For use with Mycronic AG type ejector
- Clear, pin-testable residues
- 8-12 hour tack time
- Excellent wetting characteristics, even on leadless devices
- Vapor phase compatible
- Reduces voiding under micro-BGAs
- Prolongs ejector/cassette life
NC257MD No Clean Solder Paste
AIM developed NC257MD No Clean Solder Paste specifically for use with Mycronic MY500, MY600, and MY700 jet printers. Extensive testing in collaboration with Mycronic validates NC257MD’s unique rheological properties, ensuring powerful wetting performance on continuous and consistent deposits. NC257MD extends ejector life, leading to a reduction in solder paste scrap and consumption.
This solder paste offers reduced voiding while producing minimal, clear residues that can be easily probed for testing purposes. Moreover, NC257MD boasts a long tack life of up to 12 hours, maximizing performance, increasing line flexibility, and improving soldering results.
- Provides stable dispensing and jetting performance for the most demanding assembly applications
- Reduces voiding on a variety of LED, QFN, and LGA components
- Residues are clear, pin-testable with high SIR properties
- Formulated for jet dispensing with Mycronic MY500, MY600, and MY700 jet printers
| Alliages | Températures de fusion (℃) | Peak Reflow Temperature Range (℃) | Attributs de l'alliage |
|---|---|---|---|
| SAC305 | 217°C -220°C | 230°C-260°C | - Excellentes caractéristiques de mouillage |
| Sn63/Pb37 | 183°C | 205°C-235°C | - Alliage Legacy pour le brasage électronique |
*T4 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.
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