NC217
NO CLEAN GEL FLUX
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Caractéristiques
- Formulated for Rework and Repair
- Ideal for BGAs: Wide Process Window
- Electrically Safe Unheated
- ROL0
- Controlled Application
- Easy to Clean Residue
- Passes SIR in Raw State
NC217 No Clean Gel Flux
Description du produit
Utilisation de l'application
Données sur le produit
Documents techniques
Description du produit
NC217 No Clean Gel Flux is specifically formulated for rework of all types of surface mount components. Its gel-like consistency is engineered for easy touch-up and precise flux application.
Dried, NC217 flux residues pass IPC J-STD-004* SIR without additional heat and are tack-free in 2-4 hours. The powerful activator system of NC217 promotes wetting and shiny joints even on difficult to solder surfaces.
NC217 is compatible with AIM’s entire line of no clean solder paste, cored solder wire, and flux formulations, meeting IPC-610 flux requirements.
Utilisation de l'application
- Ideal for BGA rework/reballing and QFN/LGA repair
- Residues can be left on the board after soldering
• When cleaning is required, residues can be removed using common flux removers - Wide process window offers increased manufacturing flexibility
- Residues pass SIR without adding heat
• Ideal for automotive, medical, and aerospace applications - Tin-Lead and lead-free compatible
- Improved heat transfer results in reduced cycle time
- Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units
Données sur le produit
| Type de flux | Applications | Application Method | Alloy Compatibility |
|---|---|---|---|
| ROL0 | BGA Sphere Attach Rework Component Removal | Dispense Dip | Pb and PB-Free |
Documents techniques
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