AIM engineered J8 No Clean Jetting Solder Paste for use with dispensing and jetting equipment, producing consistent deposits as small as 200μm required for fine-pitch applications. The paste is capable of air or nitrogen reflow and features a novel activator system that provides powerful, durable wetting performance. It accommodates a wide range of profiles, resulting in bright, shiny joints and mitigating HiP defects.

J8 is fully compatible with all AIM no clean solder pastes, making it the ideal choice for assemblies where a combination of jetted paste with printed paste is necessary. J8’s post process residues are minimal and reliable, passing IPC-004 current revision SIR and Bono testing. In testing, J8 has demonstrated the ability to reduce voiding to as low as <5% on BGA and <10% on BTC ground pads.

AIM’s J8 dispensing paste is formulated to be clog-free and to have a long ejector life, effectively reducing paste waste and consumption costs. It is available in SAC305 and Sn63/Pb37, making it a versatile option to optimize throughput and minimize mission-critical defects.

• Excellent jetting performance capable of consistently printing deposits as small as 200μm
• Novel activator system providing powerful wetting action in air or nitrogen reflow
• Zero-clog dispensing
• Available in type 6 Sn63/Pb37 and SAC305 jetting paste
• Developed for use in industry leading jetting and dispensing equipment (Essemtec, Vermes, etc.)
• Not for use with Mycronic jetters (see AIM NC257MD jet printing solder paste)

*T6 powder mesh size is standard. Additional powder sizes and alloys may be available upon request.

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• J8 TDS - Anglais
• Consulter la FDS (Fiches de données de sécurité)